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佐佐木元

学术报告 《Development of High-Performance Heat Sink Composite Material》

活动时间:2020年11月25日(周三)14:30 – 16:00 活动地点:机械馆J3报告厅

报告时间:2020年11月25日(周三)14:30 – 16:00

报告地点:机械馆J3报告厅

报告形式:远程视频

报告人:佐佐木元(Sasaki Gen)

报告人简介:

zuozuomuyuanbiyeyuribendongbeidaxue,xianzaishiribenguangdaodaxuedaxueyuangongxueyanjiukejiaoshou,boshishengdaoshi。zhuyaodeyanjiufangxiang:youguangaogongneng・gaoxingnengjinshu、taocijijinshujifuhecailiaodewulixianxiangdechanminghekaifadeyanjiu。zhuanyelingyubaokuojixiecailiao(jinshujifuhecailiao、taocijifuhecailiao、lv/meidengqingjinshucailiao)、dianzixianweijinghexshexianyanshedebiaozheng。muqianyanjiudefangxiangweigaogongneng・gaoxingnengjinshu、taocijijinshujifuhecailiaodewulixianxiangdechanminghekaifa。jiyunami・yaweimichicunjibiexiazuzhiguancha,zuzhidinglianghuayijiliyongjisuanjimonidejianmolaizhidaojiagonggongyi,congershixianduicailiaozuzhidediaokong。zuixindeyanjiufangxiangweifuyufangxiangxingdegaorechuandaojinshujifuhecailiaodekaifaherechuandaotexingdelilunpingjia。zaimaterials science and engineering a, journal of materials processing technology, journal of alloys and compoundsdengguojiqikan,ribenjinshuxuehuizhi,fentihefenmoyejin,qingjinshudengribenguoneiqikan,yijiguojihuiyishangfabiaolunwen123pian。cengrenribenfentifenmoyejinxiehuicanshi,ribenzhuzaogongchengxuehuibianjiweiyuanhuitongxingpingshenhuiyuan;xianrenribenfuhecailiaoxuehuilishi,qingjinshujiangxuehuixuankaoweiyuanhuixuankaoweiyuan,ribenjixiexuehuijixiecailiao・shengchanjiagongbukuodazhidaoweiyuanhuiweiyuan,guangdaoshichanyejishuzhiyuanguwen。binghuode2016nianribenjixiegongchengshixuehuijixiecailiaohecailiaojiagongfenhuixingnengjiang。

报告内容简介:

withthe rapid development ofintegration and miniaturization in electronic devices and circuitry, heat dissipation has emerged as a severe issue in recent years.it is well knownpoor heat dissipation will significantly despair the performance of electronic devices because of heat accumulation induced high temperature. therefore, how to enhance the heat dissipation has become a hot research topic. all electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. there are several techniques for releasing heat including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others, among which heat sinks are the most effective way to transfer heat. heat conduction efficiency of heat sinks highly depends on the interfacial thermal resistance and intrinsic thermal conductivity of heat sink materials. accordingly, we are focusing on developing different novel metal matrix composites (mmcs) with high performance as heat sink materials, since the microstructure of mmcs can be tailored in order to achieve high thermal conductivity as well as high performance. in this report, we will introduce some novel mmcs synthesized in our laboratory from the viewpoint of interfacial design, fraction and size tailoring of reinforcement, and computational simulation to further understand the mechanism of thermal enhancement of mmcs for the application of heat sink materials.

*benbaogaoyoutianbotiyuappxiazaiyincaiyinzhiguojihezuopeiyuxiangmuzizhu。

jixiegongchengxueyuan

2020nian11yue18ri

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